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ESDA to Host Day-Long AI Design Session at SEMICON West

The Electronic System Design Alliance will host a day-long session at SEMICON West, with a TSMC keynote, nine presentations, an IEEE panel on agentic AI, and McKinsey insights.

By SamacharDaily Editorial Team • • 1 min read

The Electronic System Design Alliance (ESDA), a SEMI technology organization, is staging a day-long design session at SEMICON West titled “Bridging Design and Manufacturing with AI.” The program aims to connect semiconductor design and production workflows through artificial‑intelligence approaches.

A senior executive from TSMC will open the event with a keynote called “Scaling Leadership Silicon with AI,” followed by nine technical presentations covering recent advances in AI‑driven chip development.

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The agenda also includes an IEEE‑hosted panel on “True Value and Cost of Agentic AI in SoC Design and Manufacturing,” a McKinsey briefing titled “Design at AI Speed,” and speakers representing EDA, IP, memory, storage, AI hardware firms, and an equipment manufacturer that will complete the program.

Why This Matters

By gathering leading design houses, manufacturers, and AI specialists, the session highlights how artificial intelligence can compress chip development cycles, lower costs, and improve alignment between design intent and manufacturing reality. Stakeholders—from silicon foundries to equipment suppliers—stand to gain competitive advantage as AI tools become integral to next‑generation semiconductor production.

Reporting based on verified dispatches from Eejournal. View primary release ↗
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